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Lukyanov, Kopyltsov and Serov: Semiconductor-Wafer Simulation

Gennadi Lukyanov, Alexander Kopyltsov and Igor Serov modeled the electromagnetic response of a semiconductor wafer with coupled ring grooves. Springer published the chapter online on August 3, 2022, in the proceedings of the Seventh International Congress on Information and Communication Technology; the volume carries a 2023 publication year.

Patterned geometry and field response

The study describes a Lifetune resonator with self-affine surface relief and grooves 0.2 µm wide and 0.8 µm deep. The two-dimensional model examines the evolution of electric-field strength across a 20 × 20 mm plane. It compares different boundary conditions, including a central sink and a configuration without that sink.

The authors’ conclusion

The simulation develops a stable distribution containing multiple wave frequencies and orientations. Its general spatial character persists when the incident period changes. This provides a computational account of how the surface acts as a transducer of incident radiation.

Original Springer publication and DOI · Original chapter PDF.

Connecting simulation and experiment

The chapter follows earlier semiconductor-surface modeling and cites the authors’ 2007 work. Lukyanov and Makarov’s 2026 infrared experiment then measures the patterned wafer’s behavior during repeated heating and cooling, adding experimental surface observations to this development history. Read the 2026 ICICT publication.

Related research and topic guides

Source-linked research summary updated October 26, 2026. Original studies and reviews are credited above.